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1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module

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Witgain Technology Limited

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1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module

Name: 16 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module
Brand: WITGAIN PCB
Price: 1 USD

Quality 1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module for sale

Brand Name : WITGAIN PCB

Model Number : Half hole PCB0005

Certification : UL

Place of Origin : Guangdong China

MOQ : 1 pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100k pcs/month

Delivery Time : 20 days

Packaging Details : Vacuum bubble bag packaging

Material : FR4 TG>170

No of layers : 6 Layer

Solder mask colour : Green

Min BAG Pad : 8.5 Mil

Min Lind Space&Width : 3/3mil

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Half Hole PCB FR4 Substrate 6 Layer PCB GPS Modole Used 1.6 MM Thickness

Requirements:

1 All dimensions are in MM.

2 Fabricate per IPC-6012A Class2.

3 Materials:

3.1 Dielectric: FR4 Per IPC or equivalent

3.2 Min Tg: 170DEG

3.3 Copper: As per stack up

3.4 UL Rating: 94V0 Minimum

4 Surface finish: ENIG

5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

6 Editing of existing copper layers shall require customer approval.

7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.

Layer Stackup:

1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module

Material Data Sheet:

S1000-2
Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	180
Tg		IPC-TM-650 2.4.24.4	DMA	℃	185
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	345
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	45
			After Tg	ppm/℃	220
			50-260℃	%	2.8
T260		IPC-TM-650 2.4.24.1	TMA	min	60
T288		IPC-TM-650 2.4.24.1	TMA	min	20
T300		IPC-TM-650 2.4.24.1	TMA	min	5
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	100S No Delamination
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	2.2 x 108
Volume Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ.cm	4.5 x 106
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	7.9 x 107
Surface Resistivity		IPC-TM-650 2.5.17.1	E-24/125	MΩ	1.7 x 106
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	100
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	63
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1MHz	--	4.8
Dissipation Constant (Dk)		IEC 61189-2-721	10GHz	--	—
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1MHz	--	0.013
Dissipation Factor (Df)		IEC 61189-2-721	10GHz	--	—
Peel Strength (1Oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.38
			125℃	N/mm	1.07
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	562
Flexural Strength	CW	IPC-TM-650 2.4.4	A	MPa	518
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.1
CTI		IEC60112	A	Rating	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
Flammability		UL94	E-24/125	Rating	V-0

Product Tags:

1.6 MM PCB Electronic Board

FR4 Substrate pcb electronic board

6 Layer PCB GPS Module

1.6 MM Thickness PCB Electronic Board Half Hole FR4 Substrate 6 Layer PCB GPS Module Images

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